Fed up of the thick LSI chips which tend to fail in event of high stress situations such as getting bent? Realizing these problems TDK and Semiconductor Energy Laboratory have come up with a new technology for RFID tag integrated circuit mounted on flexible substrate. Here they are integrating RFID integrated circuit with flexible substrate.




The companies claim to have operated the world's first RFID integrated circuit for UHF band formed on flexible substrate and have even developed RFID integrated circuit operating at 13.56 MHz. What we get as a result is exceedingly thin and flexible substrate which can be formed as thin inlets which are just 30mm thick. Due to the thinness one won't feel the unevenness in case it is embedded in high quality paper as thick as 100 mm.